WELCOME TO MSEIC 2026 !
DAY
HOUR
MINUTE
SECONDS
- About to MSEIC 2026 !
The International Conference on Materials Science, Electromagnetics, and Intelligent Communication (MSEIC 2026) will be held grandly in Shenzhen, the capital of scientific and technological innovation in China. This conference focuses on the deep integration of advanced materials, electromagnetic theory, and intelligent communication technology, aiming to build a high-level, interdisciplinary international academic exchange platform, gathering experts, scholars, researchers, engineers, and high-tech enterprise R&D representatives in the fields of materials science, electronic engineering, electromagnetic field and microwave technology, communication systems, artificial intelligence, and the Internet of Things. The conference will focus on in-depth discussions on cutting-edge topics such as the application of new functional materials (such as low dimensional materials, metamaterials, ferroelectric/piezoelectric materials) in electronic devices, the interaction mechanism between high-frequency electromagnetic waves and materials, the material design of high-performance antennas and RF devices, electromagnetic compatibility and shielding material technology, millimeter wave and terahertz material solutions in 5G/6G communication, intelligent surfaces (RIS) and programmable electromagnetic materials, AI based electromagnetic signal modeling and spectrum optimization, material driven intelligent sensing and communication integrated systems, the progress of flexible electronic materials in wearable communication devices, semiconductor packaging materials and high-speed interconnect technology. Through various forms such as keynote speeches, thematic forums, paper presentations, experimental results displays, and system simulations, we aim to promote collaborative innovation across the entire "materials electromagnetic communication" chain and break through the technological bottlenecks in speed, energy efficiency, and integration of next-generation communication systems. MSEIC 2026 emphasizes the core concept of "material driven intelligence and electromagnetic empowerment", committed to leading the transformation of communication technology through material innovation, and supporting the development needs of intelligent terminals, data centers, connected vehicles, and integrated networks of air, space, and earth. The high-quality papers accepted by the conference will be recommended for publication in relevant SCI, EI, or IEEE indexed international journals to enhance academic influence.
-
CALL
FOR
PAPERS
-
theme Chemical Engineering, Materials Chemistry Biomaterials and Biomedical Engineering Coupling of multiple ferroelectric order parameters Domain size effect, granularity effect, small particles, thin film Composite materials/building materials Ceramic and glass materials Engineering in the field of crystallography Electronic and magnetic materials Metallic materials Electromagnetic measurement Electromagnetic packaging Electromagnetic modeling of devices and circuits Electromagnetic properties of materials EMC/EMI/Electromagnetic Pulse Inverse scattering Metamaterials Phased array and adaptive array Material Processing Engineering Nanomaterials and Nanotechnology Computational Materials Science Evolution of microstructure in the field Materials for Energy and Environmental Applications
....-About Plagiarism Check-
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
中文特别声明
出版社在论文出版前会对论文重复率进行检测,重复率大于20%的稿件将被拒绝出版;重复率不大于20%的稿件中,如有整段大面积的直接复制其他作者文章内容的情况,也会被拒绝出版。以上两种涉及抄袭的情况,一旦被出版社证实,文章将被拒绝出版,并且不退回任何会议注册费用。
Download template (Word)
-Record-
All full paper submissions to the MSEIC 2026 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of MSEIC 2026 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
-Submission Portal-
Mail Address: mseic@sub-paper.com
If you have any questions or need any help about the conference, please feel free to contact our conference experts on the right:
姚老师
WeChat/TEL:19980549140
QQ:1912800772
E-mail:mseic@sub-paper.com
-Submission Guidelines-
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to mseic@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (mseic@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Technical Sponsor
Important Dates
Submission Deadline
2026-03-17
Registration Deadline
2026-03-24
Conference Date
2026-03-31
Notification Date
About a week afterthe submission
Indexing Service
Follow Us